Open rack features :
• Easily assemble and disassemble for delivery, low-cost.
• Can be bolted directly to floor
• Maximum access for cable management and equipment maintenance
• Various optional accessories according to requirements (cable management slot, removable working panel,etc).
• Flexible packing methods allows for convenient stocking and end user delivery.
• Multiple sizes available.
• Customization requests welcome
The problems the Open Rack seeks to solve encompass:
• Different mechanical form factors require different implementation schemes and force vendor lock-in without associated benefit, as typified by blade servers.
• Redundant power distribution integrated into and specific to each server.
• Outdated cable management with proprietary interconnects.
• Impractical compute density, restricted by thermal design.
• Inefficient serviceability.
• Inflexible installation processes.
• Inefficient component upgrade cycles.
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The Open Rack form factor other :
• 23.6" wide rack, as floor steps in most data centers are 24". This provides flexibility for the chassis form factor within a 21" wide equipment bay. Racks are traditionally 19" wide.
• "Practical density." We have designed a larger aperture (the opening in the front) to improve airflow and create a good thermal profile. This allows for higher compute density.
• 36-45" rack depth makes serviceability more practical and thermal flows more efficient. Normal equipment depth is 33", with the remainder used for bus bars and cables.
• Up to 45U rack height maximize the density allowed while also allowing deployment into most data centers. The accepted rack height is 95".
• At least 1 power zone per column. A power zone comprises the power shelf solution and the equipment bay that it powers. Power solution can be single- phase AC or three-phase AC, or HVDC. The width of the power shelf can be as wide as the equipment bay itself. The height is measured in 0.5U increments.
• The Open Rack increases compute density, demonstrates flexibility in design, improving efficiency and lowering cost.
• Maximum of three 1U rack switches, allowing iteration on the compute density reinforced by one or more power zones.
• Compatible with all form factors and provides interoperability between different suppliers.
• A modular chassis that accommodates multiple sleds, so there can be multiple motherboards in a given chassis in either horizontal or vertical layouts; the chassis can be of varying height and can be pre-integrated into the rack.
• A universally flexible combination mounting scheme for the equipment bay that provides for fixed or adjustable mounting options in a variety of configurations in 0.5U increments.
• A slot in the equipment bay is measured in 0.5OU steps. An OpenU (OU) is 48mm.